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Computex 2026 Wrap-Up: AI PC Chip War Begins, NVIDIA RTX Spark Arrives Fall 2026

· 3 min read
Industry Research Team

June 6, 2026 — COMPUTEX 2026 concluded yesterday in Taipei. Under the theme "AI Together," this year's event set records with 1,500+ exhibitors and 6,000 booths. The head-to-head battle between NVIDIA, Intel, and AMD in the AI PC space was the defining story of the show.

1. NVIDIA RTX Spark: June Launch at $1,399

Less than a week after its COMPUTEX debut, the NVIDIA-MediaTek RTX Spark Superchip confirmed its commercial timeline:

DetailInfo
Launch OEMsASUS, Dell, HP, Lenovo, Microsoft Surface, MSI
AvailabilityFall 2026
Starting PriceNot yet announced (analysts estimate $3,000-4,000)
Core SpecsArm CPU (up to 20 cores) + Blackwell GPU (6,144 CUDA cores)
Unified Memory128 GB LPDDR5X (300 GB/s)
Model CapacityRuns 120B parameter models, up to 1M token context

Market Reaction: AMD, Intel, and Qualcomm shares fell following the announcement. Analysts believe RTX Spark will reshape the market across three fronts — Windows AI PCs, creator workstations, and edge inference nodes.


2. Intel 18A in Full Production: Clearwater Forest + Crescent Island

Intel CEO Lip-Bu Tan delivered his first COMPUTEX keynote with two key updates:

Clearwater Forest (Xeon 6+)

  • 288 cores, Darkmont architecture
  • First Intel 18A process node data center CPU
  • Foveros Direct 3D packaging
  • Now in full production

Crescent Island AI GPU

  • 480 GB LPDDR5x memory
  • 350 W air-cooled PCIe form factor
  • Native FP4 support, targeting agentic inference
  • Shipping H2 2026

"As AI moves into the agentic era, the CPU returns to the center of modern AI infrastructure." — Lip-Bu Tan


3. AMD Ryzen AI 400 Series Now Shipping

AMD showcased the Ryzen AI 400 series (Zen 5 + Zen 5C hybrid + XDNA2 NPU) at COMPUTEX:

  • NPU performance: 60 TOPS, the highest in x86
  • 7 consumer SKUs + commercial PRO series
  • Multiple OEM models already available or launching soon
  • Advancing AI 2026 summit set for July in San Francisco

4. Chinese Domestic Chips Gaining Momentum

VendorProductStatus
HuaweiAscend 950PR/950DTIn production, self-developed HBM
CambriconMLU6902 PFLOPS FP8, shipping
Moore ThreadsMTT S50001,000 TFLOPS, specs public

5. The AI PC Era: Three-Way Roadmap Comparison

DimensionNVIDIA RTX SparkIntel Clearwater Forest + Crescent IslandAMD Ryzen AI 400
CPU Cores20-core Grace (Arm)288-core Darkmont (x86)Up to 12-core Zen5+5C
GPU/NPUBlackwell GPUCrescent Island (discrete GPU)XDNA2 NPU (60 TOPS)
AI Compute1 PFLOPSTBD60 TOPS NPU
TargetPersonal AI agentsDual-track: DC + AI PCCopilot+ PC
ProcessTSMC 4NPIntel 18ATSMC 4nm
AvailabilityJune 2026H2 2026Shipping now

This Week in AI Compute (6/1 – 6/6)

DateEvent
Jun 1NVIDIA GTC Taipei: RTX Spark, Vera Rubin production, DGX Station for Windows
Jun 1Intel unveils Crescent Island, Clearwater Forest
Jun 2COMPUTEX 2026 opens: "AI Together"
Jun 5COMPUTEX closes: 1,500+ exhibitors, record scale
Jun 6RTX Spark confirmed June launch at $1,399

Sources: COMPUTEX Daily, Tencent News, Phoenix Technology, Xueqiu, The Silicon Review.

Computex 2026 AI Compute Card Major Events: DGX Station for Windows, Intel Crescent Island, and More Major Launches

· 4 min read
Industry Research Team

June 1-5, 2026, Taipei — Computex 2026 (Taipei International Information Technology Show) wrapped up successfully this week. With the theme "AI Together," industry giants including NVIDIA, Intel, AMD, and Qualcomm unveiled numerous AI compute products in rapid succession. Below, MirrorFrog brings you a roundup of the most noteworthy developments in the compute card space this week.

① NVIDIA DGX Station for Windows: A Desktop AI Supercomputer

NVIDIA officially launched the DGX Station for Windows during its Computex 2026 keynote, calling it "the world's most powerful desktop AI supercomputer."

Core Specifications

ItemSpecification
ChipGB300 Grace Blackwell Ultra Desktop Superchip
GPU Memory252 GB HBM3e (7.1 TB/s)
CPU Memory496 GB LPDDR5X (396 GB/s)
Unified Memory748 GB (NVLink-C2C interconnect)
FP4 Compute20 PFLOPS (sparse)
FP8 Compute10 PFLOPS (sparse)
NetworkConnectX-8 SuperNIC, up to 800 Gb/s
Model CapacityCan run 1 trillion parameter models
System Power1,600 W
Operating SystemMicrosoft Windows
ShippingQ4 2026

Significance: DGX Station compresses AI compute power (20 PFLOPS FP4) that previously required datacenter-class clusters into a single desktop workstation. 748GB of unified memory means developers can run models with hundreds of billions or even trillions of parameters locally, without cloud dependency.


② Intel Crescent Island: Inference-Specialized AI GPU

At Computex, Intel disclosed detailed specifications for its next-generation datacenter AI inference GPU, Crescent Island.

ItemSpecification
MemoryUp to 480 GB LPDDR5x
Power350 W (PCIe form factor)
Precision SupportFP4/MXFP4 → FP64 (full precision coverage)
TargetAI inference workloads (Agentic Inference)
PositioningBetter price-performance than HBM solutions
ShippingH2 2026

Significance: Crescent Island represents Intel's key strategic move in the AI inference market. 480GB of massive LPDDR5x memory (non-HBM) means significantly lower cost compared to NVIDIA H200/B200 and other competing products, targeting enterprise inference deployment scenarios.


③ Intel Xeon 6+ (Clearwater Forest): First Intel 18A Datacenter CPU

Intel also unveiled the new Xeon 6+ processor, codenamed Clearwater Forest, its first datacenter CPU built on the 18A process:

  • 288 Darkmont architecture cores
  • L2 288MB + L3 576MB cache
  • 12-channel DDR5-8000 memory
  • Foveros Direct 3D advanced packaging
  • AI Agent Era: CPU returns to the center of infrastructure

④ NVIDIA RTX Spark Ecosystem Takes Shape

This week, the RTX Spark super chip developed in collaboration between NVIDIA and MediaTek continued to generate buzz. Multiple OEMs showcased RTX Spark-based laptop and compact desktop prototypes:

  • ASUS, Dell, HP, Lenovo, Microsoft Surface, MSI all confirmed as launch partners
  • Equipped with 20-core Grace CPU + Blackwell GPU (6144 CUDA cores)
  • AI compute 1 PFLOPS
  • Retail availability Fall 2026

⑤ Intel × Foxconn AI Infrastructure Partnership

Intel and Foxconn announced a joint AI infrastructure initiative, covering the complete chain from chip → server → rack-scale system, targeting the datacenter market opportunity driven by surging AI inference demand.


⑥ Domestic AI Chip Developments

According to the IDC 2025 annual report, total AI accelerator card shipments in China reached approximately 4 million units, with domestic vendors shipping approximately 1.65 million units, capturing a market share exceeding 41%. Huawei's Ascend 950 series has entered mass production and delivery, while Cambricon's MLU690 has begun shipping to internet customers.


This Week's Compute Roundup

VendorProductHighlightTimeline
NVIDIADGX Station for Windows20 PFLOPS, 748GB unified memoryQ4 2026
NVIDIARTX Spark1 PFLOPS AI PC chipFall 2026
IntelCrescent Island GPU480GB LPDDR5x, 350WH2 2026
IntelXeon 6+ (Clearwater Forest)288 cores, Intel 18AH2 2026
Intel + FoxconnAI infrastructure partnershipChip→rack full chainStrategic partnership
HuaweiAscend 950PR/DT1 PFLOPS FP8, self-developed HBMIn mass production
CambriconMLU6902 PFLOPS FP8, 192GB HBM3EShipping

Sources: NVIDIA GTC Taipei 2026 / Computex 2026 official announcements, Intel press releases, ifeng Tech, IT Home.

Huawei Ascend 950 Mass Production and the Full Picture of China's AI Chip Ecosystem

· 4 min read
Industry Research Team

June 2026 — Huawei's Ascend 950 series (950PR / 950DT) has entered formal mass production and delivery, a landmark event for China's AI chip industry in 2026. Meanwhile, Cambricon's MLU690 has begun shipping and Moore Threads has announced MTT S5000 specifications, formally establishing China's tri-polar AI chip landscape.

Ascend 950 Series: A Historic Breakthrough with Self-Developed HBM

Huawei HiSilicon's Ascend 950 series is the fourth-generation Ascend AI chip, first revealed at Huawei Connect 2025 in September and entering mass production in Q1 2026.

950PR (Prefill Inference Specialized)

ItemSpecification
ArchitectureDa Vinci v5 (SIMD + SIMT dual-model)
ProcessN+2 (SMIC domestic)
HBMHiBL 1.0 (Huawei self-developed) , 128 GB
FP8 Compute1 PFLOPS (HiF8 format)
TDP~400 W
TargetInference Prefill (video recommendation, real-time interaction)

950DT (Decode + Training Specialized)

ItemSpecification
ArchitectureDa Vinci v5 (SIMD + SIMT dual-model)
ProcessN+2 (SMIC domestic)
HBMHiZQ 2.0 (Huawei self-developed) , 144 GB, 4 TB/s
FP8 Compute1 PFLOPS (HiF8 format)
TDP~500 W
TargetInference Decode + Model Training

Historical Significance

Self-developed HBM (HiBL 1.0 / HiZQ 2.0) represents the most important technical breakthrough of Huawei Ascend 950 — this is the first time a Chinese enterprise has achieved self-developed mass production of HBM memory, completely eliminating dependence on SK Hynix / Samsung HBM supply. Combined with the domestic N+2 process, Ascend 950 has achieved full-chain domestic production from HBM → Compute Die → Packaging → System.

Cambricon MLU690: China's Only Native FP8 Support

Cambricon's seventh-generation AI chip MLU 690 (Siyuan 690) began volume production and shipping in H1 2026. This is the first domestic AI chip with native FP8 precision support.

ItemMLU 690
Process5nm (TSMC / SMIC)
FP8 dense2 PFLOPS
HBM192GB HBM3E, 5 TB/s
TDP~500 W
Unit Price (OAM)~$8,000-12,000

MLU 690's FP8 compute power (2 PFLOPS dense) is on paper comparable to NVIDIA Blackwell (B200 FP8 4.5 PFLOPS sparse). Leveraging its financing advantage as a STAR Market listed company, Cambricon targets 2026 revenue of ¥15-20B (2025: ¥7.2B).

Moore Threads MTT S5000: From Graphics to Training-Inference Unified

Moore Threads publicly disclosed detailed specifications of the MTT S5000 in February 2026, featuring the fourth-generation MUSA "Pinghu" architecture, single-card AI compute of 1,000 TFLOPS, 80GB GDDR6X memory, 1.6 TB/s bandwidth.

Moore Threads pursues a full-function GPU path (graphics rendering + AI compute + general-purpose compute), closest to NVIDIA's strategy. The founding team comes from former NVIDIA China, and the MUSIFY toolchain helps auto-migrate CUDA code to the MUSA platform, lowering ecosystem migration costs.

China's Tri-Polar AI Chip Landscape

DimensionHuawei AscendCambriconMoore Threads
Core ArchitectureDa Vinci v5MLUv07MUSA 4th Gen
ProcessN+2 domestic5nm6nm
FP8 Compute~1 PFLOPS2 PFLOPS0.5 PFLOPS (estimated)
HBM Self-Sufficiency✅ Self-developed HiBL/HiZQ❌ Purchased❌ Purchased
EcosystemCANN + MindSporeNeuWare + MindSporeMUSA + MUSIFY
AdvantageFull-chain domesticHighest FP8 computeFull-function + CUDA migration
2025 Revenue(Huawei internal)¥7.2B¥2.2B

Global Market Comparison (Q2 2026 Update)

TierVendorFlagship ChipFP8/PFLOPSHBMMass Production
Tier 1NVIDIARubin R20025 PF (sparse)288GB HBM42026 H2
Tier 2AMDMI40020 PF (dense)432GB HBM42026
HuaweiAscend 950DT1 PF (dense)144GB self-developed HBM2026 Q1
CambriconMLU6902 PF (dense)192GB HBM3E2026 H1
AWSTrainium 35.7 PF (dense)144GB HBM2025 Q4 GA
Tier 3IntelGaudi 31.8 PF128GB HBM2eIn production
GoogleTPU v74.6 PF(TFLOPS)192GB HBM2025
Moore ThreadsMTT S50001 PF80GB GDDR6X2025 Q1

Note: NVIDIA uses sparse compute as standard, while AMD / Huawei / Cambricon use dense — not directly comparable.

Outlook for H2 2026

  • NVIDIA Rubin R200: Official shipment in H2 2026, 288GB HBM4, 6-chip CoWoS-L packaging
  • Huawei Ascend 960: Roadmap H2 2027, expected FP8 compute doubled to 2 PFLOPS
  • Cambricon MLU790: Expected 2027, 3nm, 384GB HBM4, 2.5 PFLOPS
  • Moore Threads: Next-gen GPU expected with HBM3, 2× MTT S5000 compute

By 2026, China's AI chip industry has formed a complete product matrix from Training (Cambricon MLU690 / Ascend 950DT) → Inference (Ascend 950PR / Moore Threads S5000) → Systems (CloudMatrix / Distributed Clusters).


This article is based on public information from Huawei Connect 2025 (2025-09-18), industry analysis reports from April 2026, and the latest market data as of June 2026.

2026 H2 Top AI Chip Selection Guide: From H100 to Rubin, MI400, TPU 8t, TPU 8i

· 8 min read
Industry Research Team

2026 H2 is the richest era for the AI compute market: NVIDIA Rubin R200, AMD MI400, Trainium 3, TPU 8t/8i, Ascend 920, and Groq 3 LPX are all in place. This article provides a complete selection tree to help you choose the most suitable product based on model size, training/inference, latency requirements, budget, and region.

2026 Global AI Computing Report & Ten Major Computing Industry Trends Released

· 7 min read
Industry Research Team

On May 29, 2026, during the World Intelligence Expo 2026 in Tianjin, the China Intelligent Computing Industry Alliance, National Supercomputing Center in Tianjin, Tianjin Artificial Intelligence Society, Shenzhen Artificial Intelligence Industry Association,ZDNET, and ZDNET ThinkTank jointly released the "2026 Global AI Computing Development Research Report."

The report analyzes the current state and future trends of the global AI computing industry, revealing that the sector has entered a new stage of "intelligence-driven, system-reconstruction."

Core Viewpoints

1. Computing power becomes a national strategic element

The global computing industry is entering a new stage of "intelligence-driven, system-reconstruction." With the rise of the "token economy," computing power has become a key foundational element supporting national technological breakthroughs, industrial competition, and strategic positioning.

Computing is evolving from traditional IT support into a strategic bedrock driving scientific innovation and the industrial revolution.

2. AI computing development covers the full chain

AI computing development must upgrade the full chain of chip, system, and compute cluster, while matching the differentiated computing needs of model training, inference, and data preparation.

  • Training: pre-training of super-large models needs ten-thousand-card-scale compute
  • Inference: super-large models need thousand-card-scale compute
  • Data preparation: needs tens to hundreds of cards

Compute demand at both training and inference ends will keep growing.

3. Domestic AI chip industry's distinctive path

The domestic AI chip industry follows a route of "autonomy + cluster breakthrough + hardware-software integration + cost-performance advantage," distinct from the foreign pursuit of absolute single-chip compute — better suited to large-scale deployment.

4. Energy challenges for computing centers and solutions

Computing centers have become the fastest-growing source of global electricity demand. The future requires a diversified energy supply of "short-term wind-solar-storage integration, mid-term nuclear, long-term hydrogen."

Meanwhile, space computing will become a new direction to solve ground-based computing bottlenecks.

5. Compute-network convergence as a core direction

Future computing will move toward "compute-network convergence," making compute as on-demand as water and electricity — a core part of the national modern infrastructure system.

The computing network has been included in the national "15th Five-Year Plan" major engineering projects, ranked alongside public infrastructure such as hydro power.

Key Data

Compute performance evolution

MetricEvolution trend
Chip computefrom TFLOPS scale up to tens of PFLOPS
System formfrom single 8-card machine to thousand-card super-node architecture
Cluster scalefrom thousand-card clusters to hundreds-of-thousands-card clusters
Cluster powerfrom kilowatt to gigawatt scale

Global computing center capacity & energy forecast

  • Global computing center total capacity: expected to grow from 102GW (2026) to 220GW (2030)

    • AI load capacity from 62GW to 156GW, share rising to 71%
  • U.S. computing center annual electricity: expected to grow from 292TWh to 606TWh, share of national demand rising to 11%

  • China computing center total capacity: ~60GW by 2030, AI load share rising to 48%

  • Global computing center electricity: per IEA base scenario, from ~415TWh (2024) to ~945TWh (2030), ~15% CAGR

Embodied intelligence compute support data

  • Cloud compute: can generate PB-scale interaction data daily; large-model training cycle shortened from months to weeks
  • Edge compute: tens-to-hundreds of TOPS enables 10–50ms low-latency real-time perception & decision

Industry Trend Analysis

1. Heterogeneous architecture upgrade

From traditional CPU+GPU to a new GPU+LPU+CPU+DPU heterogeneous inference architecture.

CPU plays the core role of task scheduling, data pre-processing, serial tasks, and system interconnection in heterogeneous architectures. In 2010, "Tianhe-1A" pioneered large-scale CPU+GPU deployment, leading the global intelligent-computing underlying architecture direction.

2. Clear scale-up / scale-out paths

  • Scale Up: pursue extreme performance by raising single-node hardware config
  • Scale Out: add nodes for load sharing and high availability

Together they form the core support of computing system capability.

3. Super-node servers become mainstream

With ultra-high interconnect bandwidth and low communication latency, they shorten model training cycles.

Representative products:

  • Huawei Ascend 384 super-node
  • Sugon scaleX640 super-node
  • Alibaba Cloud Panjiu AL128 super-node
  • Inspur YuanNao SD200
  • Kunlunxin super-node solution

4. Long-context processing optimization

Through Compressed Sparse Attention (CSA), Heavy-Compressed Attention (HCA) and sliding-window mechanisms, build a "coarse + fine, sparse + dense" long-context modeling system to improve compute efficiency.

Representative application: DeepSeek-V4 attention architecture design.

AI chips

International vendors:

  • NVIDIA: leads high-end training/inference with Blackwell and Rubin architectures
    • GTC 2026 Taipei (June 1) major releases:
      • Vera Rubin platform in full mass production: NVL72 rack system, agent throughput 10x over Grace Blackwell
      • Vera CPU released: 88-core Olympus in-house Armv9.2, LPDDR5X 1.5TB, 1.2 TB/s, world's first CPU with native FP8
      • RTX Spark AI PC chip: co-developed with MediaTek and Microsoft (codename N1X), Blackwell GPU 1 PFLOP, 128GB unified memory, TSMC 3nm
      • Nemotron 3 Ultra open model: SSM+MoE hybrid, 5x inference speed, 30% lower cost
    • Expanding advantage via CUDA ecosystem
  • Google: deepens vertical HW/SW integration via in-house TPU
  • AWS: Trainium (training) + Inferentia (inference) for cost-effective cloud compute

Domestic vendors: a product matrix represented by Huawei Ascend 910C, Kunlunxin P800, Moore Threads MTT S5000, MetaX XiYun C600.

In 2026 Huawei proposed the "Tao (τ) Law," aiming to systematically reduce the time constant and raise transistor density via logic folding, driving domestic chip evolution.

AI workstations

  • Form factors: tower, mobile, mini — for different deployment scenarios
  • Compute tiers: entry, professional, enterprise — covering personal dev to enterprise deployment

AI servers

  • By function: training AI servers and inference AI servers
  • By deployment: cloud AI servers and edge AI servers

With high compute output, high memory bandwidth, and high-speed interconnect, suited to large-scale parallel tasks.

AI computing centers

  • Trending toward "high AI share, high power density, high electricity consumption"
  • Ultra-large AI computing centers become the construction focus
  • Energy supply moving toward diversified clean sources

Space computing is a new direction, leveraging space's continuous sunlight, extreme cold/vacuum, and interference-free environment to solve ground centers' energy, cooling, and interconnect bottlenecks. Starcloud and Guoxing Weiyu have begun exploration.

1. Scientific research paradigm shift

The "dry-wet closed loop" research paradigm becomes mainstream, forming a loop between AI-driven "dry experiments" and automated "wet experiments" via data feedback — shifting science from experience-driven to model-driven.

2. Synthetic biology empowerment

AI's multi-task learning and unknown-space exploration can decode biology's complex "sequence–structure–function" mapping, enabling breakthroughs in protein synthesis, gene editing, and nucleic-acid vaccines. E.g., the AlphaFold series revolutionized protein structure prediction.

3. Embodied intelligence support

Efficient cloud-edge compute coordination provides full-stack support for embodied intelligence — covering massive data processing, high-fidelity simulation, model training, and edge real-time perception/decision in a closed loop.

Compute-network convergence is the core direction, evolving from "interconnect first, then network" toward a national integrated computing network. The three major telecom operators have begun interconnecting their own compute with dispersed social compute nationwide, promoting ubiquitous compute supply.

The domestic computing ecosystem keeps improving, with deeper government-industry-academia-research coordination. The China Intelligent Computing Industry Alliance, National Supercomputing Center in Tianjin, regional AI societies, industry associations, and service institutions jointly build exchange platforms — driving R&D, standard-setting, technology transfer, and talent cultivation for high-quality domestic computing development.

Conclusions & Outlook

  1. Computing power is a core element of national strategic competitiveness — major countries are increasing infrastructure investment to seize the AI-era high ground.
  2. The domestic AI chip industry follows a distinctive path — via cluster breakthrough, HW/SW integration, and cost-performance, forming advantage in large-scale deployment.
  3. Computing architecture keeps evolving — heterogeneous computing, super-node servers, and long-context processing are key directions.
  4. Application scenarios keep expanding — from research paradigm shifts to synthetic biology and embodied intelligence, AI compute deeply empowers frontier fields.
  5. Computing infrastructure evolves toward compute-network convergence — future compute will be ubiquitous public infrastructure, on-demand like water and electricity.

References:

  • "2026 Global AI Computing Development Research Report" (China Intelligent Computing Industry Alliance et al.)
  • World Intelligence Expo 2026 (Tianjin, May 29, 2026)

NVIDIA Launches RTX Spark: AI Compute Enters the Personal Computer Era

· 3 min read
Industry Research Team

June 1, 2026, Taipei — During the Computex 2026 opening keynote, NVIDIA CEO Jensen Huang officially unveiled the RTX Spark super chip, marking NVIDIA's formal entry into the personal computer processor market dominated by Intel, AMD, Qualcomm, and Apple.

RTX Spark: The "Heart" of the Personal AI Computer

RTX Spark was developed in collaboration between NVIDIA and MediaTek, featuring a heterogeneous package with a 20-core Grace CPU + Blackwell RTX GPU, equipped with 6144 CUDA cores. AI compute reaches 1 PFLOPS (one quadrillion floating-point operations per second), meaning personal computers now possess computing power comparable to a datacenter-class H100 GPU for the first time.

SpecificationRTX Spark
CPU20-core Grace (MediaTek collaboration, Arm architecture)
GPUBlackwell RTX (6144 CUDA cores)
AI Compute1 PFLOPS
TargetPersonal AI Agent, local LLM inference
Launch OEMsASUS, Dell, HP, Lenovo, Microsoft Surface, MSI
AvailabilityFall 2026
Form FactorLaptop SoC + compact desktop workstation

Jensen Huang's "Full-Stack AI" Strategy

The launch of RTX Spark is a key step in NVIDIA's "full-stack AI" strategy. Jensen Huang stated during the keynote: "AI should not only run in the cloud. Everyone's computer should have the ability to run AI agents."

RTX Spark transforms NVIDIA from a datacenter GPU monopolist into a full competitor in the personal computing market. Following the announcement, shares of AMD, Intel, and Qualcomm fell accordingly.

Market Impact

  • Intel: Personal computer AI processor business faces direct threat
  • AMD: Ryzen AI series must compete at the same level
  • Qualcomm: Snapdragon X Elite's Copilot+ PC positioning challenged
  • Apple: M-series chips are no longer the only high-performance AI PC option

Vera Rubin Platform Enters Full Mass Production

During the same keynote, Jensen Huang also announced that the NVIDIA Vera Rubin platform has entered full mass production. Rubin R200 features a 6-chip CoWoS-L package (1× Vera CPU + 2× Rubin GPU die + I/O/HBM die), equipped with 288GB HBM4, 22 TB/s bandwidth, and 50 PFLOPS FP4 compute (sparse).

The Rubin NVL72 rack (72 Rubin GPUs + 36 Vera CPUs) will begin shipping in H2 2026.

Other Highlights from Computex 2026

  • AMD: Showcased the MI350 series (192GB HBM3e, 5 PFLOPS FP8 dense), officially launching in June
  • Intel: Jaguar Shores publicly unveiled for the first time
  • Qualcomm: AI 200 / 300 series inference card roadmap updated
  • Domestic AI Chip Zone: Huawei, Cambricon, Moore Threads, and others showcased their latest products

Industry Significance

The launch of RTX Spark means AI compute is no longer confined to datacenters. Individual developers, designers, and researchers will be able to run large model tasks locally that previously required cloud GPUs, potentially redefining the market landscape for personal AI computing.

The mass production of Vera Rubin further consolidates NVIDIA's absolute leadership in datacenter AI training. Together, both product lines form NVIDIA's full-stack AI computing landscape of "cloud training + personal inference."


This report is based on official NVIDIA announcements from Computex 2026 / GTC Taipei on June 1, 2026.

AI Cluster Power Crisis: 1MW Racks, Nuclear Plants, SMRs, and Green AI

· 8 min read
Industry Research Team

In 2026, AI compute growth has hit a hard constraintelectric power. With NVIDIA Rubin NVL576 single-rack power consumption at 1 MW, the xAI Colossus cluster at 200 MW, and OpenAI's planned Stargate campus at 5 GW, power supply is becoming the biggest bottleneck for AI development. This article provides an in-depth analysis of this "power crisis" and the solutions.

AI Chip Startup Survival Report: Tenstorrent / SambaNova / Graphcore in 2026

· 8 min read
Industry Research Team

2026 AI chip market enters a "winner takes all" phase. NVIDIA holds 90%+ market share, AMD struggles at 10%, and Google/AWS/Huawei/Cerebras each occupy niche segments. But a group of AI chip startups are fighting to survive in the cracks — this article analyzes the 2026 status and future of Tenstorrent, SambaNova, Graphcore, Cambricon, Moore Threads, Biren, and Iluvatar.

HBM Three-Way Battle: SK Hynix / Samsung / Micron Fight for AI Memory Supremacy

· 9 min read
Industry Research Team

The bottleneck for AI compute has shifted from compute itself to memory bandwidth and capacity. HBM (High Bandwidth Memory) , as a core component of AI chips, has a 2026 market size of $80B+, but there are only 3 suppliers globally — SK Hynix, Samsung, Micron. This article provides an in-depth analysis of this "memory three kingdoms" battle.

Rack-Scale AI Era: NVL72 vs Helios vs Groq 3 LPX vs Trn3 UltraServer — Four Major Solutions Compared

· 7 min read
Industry Research Team

2026 AI compute enters the "rack-scale" era. Single-chip comparisons have receded, and full-rack solutions have become the main battleground. This article provides an in-depth comparison of the five major rack-scale solutions: NVIDIA Rubin NVL72/NVL576, AMD Helios, Groq 3 LPX, AWS Trn3 UltraServer, and Google TPU 8t pod.