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Data center, power and networking infrastructure for AI

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Vera Rubin 全面量产:100% 全液冷 + 800V 直流供电,AI 数据中心基础设施范式重构

· 6 min read
Industry Research Team

2026 年 9 月初,供应链信息确认:英伟达 Vera Rubin 平台已于 8 月正式量产、9 月启动批量出货,无延期、无卡顿。与 Blackwell 迭代初期的产能波折不同,这次量产节奏异常平稳——谷歌云、微软 Azure、CoreWeave、甲骨文云等头部云厂商已启动机架部署。但真正值得产业记住的,不是"又一代 GPU 量产了",而是 Rubin 把液冷从"可选配置"变成了"硬性前置条件"。


1. 量产节奏:史上最平稳的一次平台切换​

根据产业链调研与券商跟踪信息:

  • 2026 年 8 月:Vera Rubin 正式量产;
  • 2026 年 9 月:批量出货启动;
  • 2026 下半年:CoreWeave、谷歌云、微软 Azure、甲骨文云机架部署落地;
  • 2026 年:上代 GB 架构机柜出货量有望达 6 万台(同比翻倍);
  • 2027 年:GB 与 Rubin 两代平台合计出货体量有望接近 10 万台,Rubin 新机柜远期产能目标为每天 1000 个 NVL72 机柜。

需求侧同样在加码:华尔街报告披露,英伟达管理层表示 FY28 同比增长 70% 的目标并非需求上限——若供应不受限,增速可能超过 100%。当前主要约束已从需求端转向先进晶圆与 HBM 供应。

2. 单卡 2300W:风冷时代的终结​

Rubin 平台与前代最根本的差异不在算力,而在功耗密度:

指标H100GB300Rubin
单 GPU TDP700W~1400W2300W
机柜功耗~40kW~140kW190–230kW
散热方案风冷为主风液混合100% 全液冷
供电架构48V48V800V 高压直流

单芯片 TDP 从 700W 升至 2300W、单机柜功率密度突破风冷物理极限——这意味着 液冷不再是高端算力的选配升级,而是运行 Rubin 服务器的先决条件。英伟达官方将 Rubin 全液冷架构定义为"数据中心历史上最重要的能效突破之一",并已写入 DSX AI 工厂参考设计:所有跟随英伟达技术路线的云厂商和数据中心运营商,都必须采用全面液冷方案。

三个关键架构变化:

  1. 无风扇整机:GPU、CPU、交换机、DPU 全部器件强制采用直接冷板式液冷,45℃ 温水冷板成为出厂标配;
  2. 液冷边界延伸:散热覆盖范围从 GPU 冷板延伸至 CPU、DPU、交换机乃至光模块(液冷 Cage/鼠笼开始从"可选"变"刚需"),整套液冷系统价值量较 GB300 提升约 40%;
  3. 800VDC 供电:替代传统 48V 机架配电,整机电源 BOM 价值增长 30% 以上,PSU 电源模块从 5.5kW 向 18.3kW 迭代,固态变压器、高压直流 CDU 成为数据中心新增核心设备。

3. 对产业链的三重传导​

第一重:液冷从"配套"变"主角"。 2026 下半年以小规模部署验证为主,真正的放量窗口在 2027 年——Rubin 机架大规模铺货后,冷板、快速接头、CDU、液冷泵进入业绩兑现期。台系供应链 7 月数据已率先验证:AVC 奇鋐 7 月营收 185.9 亿新台币创历史新高(同比 +57.4%),双鸿、健策 7 月同比分别 +116.7%、+91.0%。

第二重:国产液冷供应链进入核心 BOM。 国内厂商由外围冷源和代工环节逐步进入芯片平台、服务器 ODM 和海外云厂商供应体系,替代路径从 Manifold、管路推进至高可靠快接头和冷板。英维克 26H1 海外收入占比 71.4%,飞龙股份液冷泵小功率平台订单超 5 万台——液冷全核心零部件自主可控正在成为现实。

第三重:供电与散热边界融合。 800VDC 架构下,电源模块、PDB 配电单元、高速交换芯片自身发热也达到很高水平,部分电源组件同样需要液冷辅助散热——电源与温控两条产业链正在合并成一条。

4. 需求矩阵扩容:云厂商之外,太空算力入场​

Rubin 的客户矩阵已从传统云厂商扩展至三个层次:

  • 全球云厂商:谷歌云、Azure、甲骨文云、CoreWeave;
  • AI 科技巨头:马斯克公开披露 2027 年 8GW 超大规模 IDC 建设规划;SpaceX 将 Vera Rubin 架构定义为"最优 AI 计算架构",计划地面与太空双向部署,支撑 "Starmind" 卫星算力项目;
  • 主权与边缘:远期 Rubin Ultra 及 2027 年后更高功耗机型单机柜有望冲击 600kW+。

普华永道预计全球数据中心累计投资到 2035 年将达 31.6 万亿美元。AI 基础设施建设的确定性,已经从"是否建设"变成"多快建设"。

5. 对采购方的启示​

  • 机房规划前置:2027 年起采购 Rubin 级算力,液冷改造(单千瓦改造成本较高)或按全液冷标准新建,必须在预算周期一开始就纳入;
  • 看 PUE 也看水温:45℃ 温水直冷允许更高进水温度,可利用自然冷源压低 PUE——选址时人工冷源依赖度成为新的评估维度;
  • 供应商组合即风险对冲:HBM 与先进封装供应是当前核心瓶颈(详见本站 HBM4 竞速分析),供应链多元化比单点性能更重要。

相关链接​

参考资料​


本文基于 2026 年 9 月初供应链调研、券商研报与英伟达官方披露整理。出货量与功耗数据为产业链预估口径,实际以英伟达及客户正式披露为准。

Hyperscaler Custom Silicon Wave 2026: OpenAI Jalapeno, Maia 200, MTIA, TPU v8 Together "De-NVIDIA-ize"

· 6 min read
Industry Research Team

The Tuesday-afternoon AI session at Hot Chips 2026 this August was the most historically significant of the conference — not because any single chip was so powerful, but because almost everything on stage was a "hyperscaler de-NVIDIA-ization" custom ASIC: Google's 8th-gen TPU, OpenAI's first self-designed chip, Microsoft Maia, Meta MTIA, and Cerebras wafer-scale racks, all on one stage. When the world's largest AI compute buyers start treating GPUs as "one of the options," the power structure of AI hardware is loosening.


1. OpenAI Jalapeno: Building a Chip in 9 Months​

On June 24, 2026, OpenAI, together with Broadcom, unveiled its first self-designed inference ASIC, Jalapeno — the fifth member of the "custom inference chip club."

DimensionJalapeno
PartnerBroadcom + TSMC manufacturing
PositioningInference-specific ASIC
Design cycle9 months end-to-end (Greg Brockman says aided by OpenAI's own models)
Cost target~50% lower token cost vs general-purpose GPU stack
Commercial timingFirst deployments by end-2026; long-term goal 10GW of self-designed chips
Deal scaleUp to $10B strategic partnership with Broadcom (accelerators + networking by 2029)

The talk title "You Can Just Build Things … Chips" is itself a signal: the largest AI compute buyer no longer defaults to GPU as the only path.


2. Google TPU v8: The Biggest Architectural Pivot in a Decade — Train/Infer Split​

Google has the longest custom-chip history (2016 to now), and its 8th-gen TPU for the first time splits the product line in two:

ModelCodenamePartnerPositioningKey Specs
TPU 8tSunfishBroadcomTraining9,600 cards per pod, 121 FP4 ExaFLOPS, 2PB shared HBM, 2× ICI bandwidth
TPU 8iZebrafishMediaTekInference288GB HBM, 384MB on-chip SRAM (3× prior gen), 19.2 Tb/s ICI

On capacity, Morgan Stanley estimates based on supply-chain interviews that Google TPU production in 2026 may exceed 3 million units (a brokerage estimate, not an official target). Google is also the only vendor to achieve large-scale custom-chip deployment and sell compute externally (Gemini runs on TPUs).


3. Meta MTIA: From Recommendation Systems to a GenAI Dual Mission​

Meta's custom journey has the clearest starting point — MTIA was originally built for recommendation ranking hardware and is being pulled toward a dual mission by generative AI.

  • MTIA 300 is deployed; 400 / 450 / 500 are planned at roughly one new model every 6 months through 2027;
  • Based on RISC-V, Meta claims up to 25× compute gain;
  • Node evolves with industry cadence: 100 (7nm) → 200 (5nm) → 300 series (3nm + CoWoS);
  • In partnership with Broadcom; another chip codenamed Iris reportedly passed testing in July 2026;
  • Meta plans to start volume production of one of them in September 2026, doubling its overall compute.

4. Microsoft Maia 200/300: Most Advanced Deployment​

Microsoft's Maia 200, released January 26, 2026, is the most advanced in deployment among the four:

DimensionMaia 200
ProcessTSMC 3nm, 140B+ transistors
Compute10+ PFLOPS FP4 / 5 PFLOPS FP8
Memory216GB HBM3E, 7 TB/s
Power750W
DeploymentAlready running in Des Moines data center, serving OpenAI GPT-5.2 and Microsoft 365 Copilot

Microsoft claims roughly 3× the performance of Amazon's Trainium on specific benchmarks. The short-term strategy is a dual track of "self-designed Maia + purchased NVIDIA" in parallel — self-designed chips need time from design to mass production, and NVIDIA's mature ecosystem cannot be replaced in the short term.


5. Amazon Trainium 3 and Anthropic's In-House Team​

  • Amazon: The Trainium series is already commercial, with 1.4 million units cumulatively deployed (officially disclosed) — a multi-billion-dollar business; its strength is the AWS customer base, letting enterprises choose between NVIDIA GPUs and self-designed chips. Trainium 3 continues this path.
  • Anthropic: In August 2026 announced the formation of an in-house chip team, with no tape-out or mass-production timeline yet; initially positioned as a complement (not a replacement) to existing partnerships with NVIDIA/AMD/AWS/Google Cloud, aiming to tailor-build for the Claude architecture and shed reliance on a single GPU.

6. NVIDIA's Answer: Not a Faster GPU, But Full-Stack​

It's easy to simplify the narrative to "four companies build chips, NVIDIA defends GPU." But NVIDIA took 6 slots at Hot Chips: a RISC-V tutorial, the Vera CPU, the Rubin GPU, the BlueField-4 DPU, the Spectrum-X multi-plane network, and an LPU accelerator.

A hyperscaler ASIC replaces only one of those five pillars. If the CPU, NIC, switching fabric, and software all come from the same vendor, what you save by swapping out the accelerator is far less than the accelerator line item on the bill suggests. Rubin's play is a full-stack AI factory platform spanning seven chips and five racks — the competitive answer is "full-stack positioning," not "a faster single chip."


7. Trend Judgment: Inference De-GPU-izes, Training Still GPU-Led​

  • Inference side: The CUDA moat visibly shallows. Inference is parallelizable and replaceable at the endpoint; custom ASICs trade away the generality tax (implementing only the operations LLMs actually execute) for lower cost/token. Groq LPU, Cerebras, and various TPU/ASIC players all compete on the same metric.
  • Training side: Foundation models are still trained on GPUs, with no serious challenger in the short term. NVIDIA's three training moats (fastest silicon + NVLink + CUDA) remain firm.
  • Conclusion: Custom chips are not "replacing NVIDIA," but giving buyers a credible external negotiation option in the largest and fastest-growing battlefield — inference. That alone is enough to reshape the economics of AI infrastructure.

References​


This article is compiled from August 2026 Hot Chips on-site reports, corporate announcements, and industry analysis. Some capacity and performance figures are brokerage estimates or vendor-disclosed figures; actual results are subject to mass-produced products.