Deep analysis of AI chip architecture, HBM, interconnect, packaging
View all tagsApple Silicon is staging a comeback in the AI era. The M3 Ultra in a single Mac Studio packs 192GB unified memory (UMA) and an 80-core GPU, capable of running 70B-200B parameter LLMs locally without quantization. This is a revolution in consumer/workstation-class AI inference. This article provides an in-depth analysis of Apple Silicon's AI advantages, current ecosystem, and future.
In 2026, AMD launched MI400 (CDNA Next) + Helios 72-GPU rack, AMD's flagship solution targeting NVIDIA NVL72. This article analyzes MI400's key specifications, the Helios rack's open interconnect (UALoF) strategy, and a comparison with Rubin R200.
The NVIDIA Vera Rubin platform is NVIDIA's next-generation flagship computing platform after Blackwell. This article provides an in-depth analysis covering the naming origin, 6-chip packaging, memory subsystem, compute matrix, networking architecture, rack-scale solution, and software ecosystem.