Overview
Huawei Ascend 910B is part of the Ascend series of AI training chips, based on the Da Vinci architecture, entering mass production in 2022-2023. Under US export controls, it has become the mainstream NVIDIA alternative in the Chinese market. Equipped with 64GB HBM3 memory and 320 TFLOPS FP16 compute, it has been adopted by major Chinese AI projects at Baidu, Alibaba, Tencent, and others.
Core Specifications
| Item | Spec |
|---|
| Architecture | Da Vinci (Huawei proprietary) |
| Process | TSMC 7nm+ (including SMIC localization efforts) |
| Memory | 64 GB HBM3 |
| Memory Bandwidth | 1,224 GB/s |
| FP32 | 64 TFLOPS |
| FP16 | 320 TFLOPS |
| INT8 | 640 TOPS |
| TDP | 310 W |
| Interconnect | HCCS (Huawei proprietary) |
| Form Factor | PCIe half-height half-length |
Key Features
- HCCS High-Speed Interconnect: NVLink alternative
- CANN Heterogeneous Compute Architecture: CUDA-like
- MindSpore Framework: Huawei's proprietary AI framework
- Domestic Ecosystem: Kunpeng + Ascend + MindSpore complete stack
Use Cases
- LLM training (tens of billions of parameters)
- Domestic replacement in the Chinese market
- Government and state-owned enterprise AI projects
- Large model inference