Skip to main content

MediaTek Dimensity 9400 (Cortex-X925 Agentic AI)

Product Overview

MediaTek Dimensity 9400 is MediaTek's 2024 mobile flagship SoC released 2024-10-09, TSMC 2nd-gen 3nm (N3E) process, 291 B transistors. 2nd-gen All Big Core design: 1x Cortex-X925 @ 3.62 GHz (ARM's largest IPC improvement ever) + 3x Cortex-X4 + 4x Cortex-A720, Arm Immortalis-G925 MC12 GPU, MediaTek 8th-gen NPU 890 (world's first to support Agentic AI Engine, on-device LoRA training, on-device video generation). LPDDR5X 10667 Mbps (world's fastest phone memory), 12 MB L3 + 10 MB SLC. First shipped in Vivo X200, OPPO Find X8, Xiaomi 15.

Core Specs

ItemParameter
ArchitectureARM v9.2 (2nd-gen 3nm All Big Core)
ProcessTSMC 2nd-gen 3nm (N3E)
Transistors291 B
CPU Cores8 (All Big Core: 1+3+4 design)
Prime Core1x Cortex-X925 @ 3.62 GHz (ARM "Black Hawk", IPC +15% vs Cortex-X4)
Big Cores3x Cortex-X4 @ 3.25 GHz
Mid Cores4x Cortex-A720 @ 2.0 GHz
L2 Cache2 MB (X925) + 1 MB (X4) + 512 KB (A720)
L3 Cache12 MB
SLC10 MB
GPUArm Immortalis-G925 MC12 (12-core, hardware RT 2)
GPU Performancevs Immortalis-G720 (Dimensity 9300) +41% Peak / +40% RT / -44% power
NPUMediaTek 8th-gen NPU 890 (1 performance core + 1 flexible core)
AI EngineDimensity Agentic AI Engine (DAE) (world's first Agentic AI Engine)
AI Performance100% faster Diffusion inference, 80% faster LLM prompt, >50 token MLLM generation, 35% power savings
AI Featureson-device LoRA training, on-device video generation (Diffusion Transformer), Agentic AI, MoE LLM support
MemoryLPDDR5X 10667 Mbps (world's fastest phone memory)
Max Memory24 GB
StorageUFS 4.0 (4-channel)
5G3GPP Release-17, 4CC-CA, sub-6 GHz 7 Gbps
Wi-FiWi-Fi 7 (dedicated 4nm co-processor, 7.3 Gbps)
BluetoothBluetooth 6.0
Launch DevicesVivo X200 Pro (2024-10), OPPO Find X8, Xiaomi 15
Launch Date2024-10-09
Vivo X200 Pro Price~$900-$1,100

vs Snapdragon 8 Gen 3 / Dimensity 9300

MetricDimensity 9400Snapdragon 8 Gen 3Dimensity 9300
Process3nm N3E4nm TSMC N4P4nm TSMC N4P
CPU Cores8 (All Big)8 (1+5+2)8 (4+4)
Prime CoreCortex-X925 @ 3.62 GHzCortex-X4 @ 3.3 GHzCortex-X4 @ 3.25 GHz
GPUImmortalis-G925 MC12Adreno 750Immortalis-G720 MC12
NPUNPU 890 (8th gen)Hexagon NPUNPU 790 (7th gen)
MemoryLPDDR5X 10667LPDDR5X 8533LPDDR5X 9600
Agentic AIworld's firstnonenone
On-device LoRAsupportednot supportednot supported
On-device Video Gensupportednot supportednot supported

AI Performance Benchmarks

Model / TaskDimensity 9400 (NPU 890)Notes
Stable Diffusion 3.52x Dimensity 9300Diffusion Transformer
Llama 3 8B (Q4)1.8x Dimensity 930080% faster LLM prompt
Phi-3.5 Mini (3.8B)50+ tokens/secMLLM generation
On-device LoRA Training (1B)world firstfine-tune 1B model
On-device Video Gen (SD Video)world firstgenerate 4s 480p video in seconds
GPT-4V-class VLM (Qwen-VL)real-timemultimodal understanding
MoE LLM (Mixtral 8x7B)supportedNPU flexible core scheduling
ETHZ v6 AI Benchmark#1 in industryleading AI performance

Agentic AI Engine (DAE): Dimensity 9400 is the world's first mobile SoC supporting Agentic AI Engine. Agentic AI differs from traditional Generative AI: AI Agents can autonomously sense environments, make decisions, invoke tools, and execute multi-step tasks. Dimensity 9400's NPU 890, through its performance core + flexible core dual-core architecture, improves energy efficiency by 35%.

Use Cases

  • Vivo X200 / X200 Pro (2024-10, ~$900 starting)
  • OPPO Find X8 / Find X8 Pro (2024-10, ~$700 starting)
  • Xiaomi 15 / 15 Pro (2024-10, $700 starting)
  • Mobile LLM inference (80% faster LLM prompt)
  • On-device AI training (1B model LoRA training)
  • On-device video generation (Diffusion Transformer generates 4s video in seconds)
  • AI Agent applications (autonomous multi-step tasks)
  • Mobile gaming (Immortalis-G925 hardware RT 2 + 41% performance boost)
  • Imaging (Imagiq 1090 full HDR zoom, Generative AI Zoom 100x)

Vendor Information

ItemInformation
VendorMediaTek Inc. (Hsinchu, Taiwan)
DesignMediaTek HQ design + ARM core IP license
FabTSMC Taiwan (3nm N3E line)
Software StackAndroid 15 (OriginOS 5 / ColorOS 15 / HyperOS 2)
AI FrameworkMediaTek Dimensity Agentic AI Engine (DAE), MediaTek NeuroPilot SDK, Android NNAPI, ExecuTorch, LiteRT
Launch CustomersVivo X200 (2024-10), OPPO Find X8, Xiaomi 15
OEM CustomersVivo, OPPO, Xiaomi, Honor, Samsung Galaxy (China/India), Transsion
CompetitorsQualcomm Snapdragon 8 Gen 3 / 8 Elite, Apple A18 / A18 Pro
2025 SuccessorDimensity 9400+ (3.73 GHz X925, 2025-04)

Key Features

  • 2nd-gen 3nm (N3E) process
  • 2nd-gen All Big Core design (1+3+4 octa-core)
  • Cortex-X925 prime core (ARM's largest IPC improvement ever +15%)
  • Cortex-X925 @ 3.62 GHz (strongest single-core mobile CPU)
  • Immortalis-G925 MC12 GPU (41% perf / 40% RT / 44% power savings)
  • MediaTek 8th-gen NPU 890 (dual-core: 1 performance + 1 flexible)
  • Dimensity Agentic AI Engine (DAE) (world's first Agentic AI Engine)
  • On-device LoRA training (world's first 1B model on-device training)
  • On-device video generation (world's first Diffusion Transformer video)
  • MoE LLM support (Mixtral 8x7B flexible core scheduling)
  • LPDDR5X 10667 Mbps (world's fastest phone memory)
  • Wi-Fi 7 (dedicated 4nm co-processor, 7.3 Gbps)
  • Bluetooth 6.0, 5G sub-6 7 Gbps, 3GPP R17
  • Imagiq 1090 (HDR zoom, Generative AI Zoom 100x)
  • MiraVision 1090 (OLED de-burn compensation)
  • 24-bit 384 KHz Bluetooth audio