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Tsingmicro TX81 (2024)

Product Overview

TX81 is Tsingmicro's cloud high-compute AI chip mass-produced in 2024, based on Tsingmicro's self-developed reconfigurable computing architecture (RPU) design, using unique C2C (Compute-to-Compute) computing grid technology, building high-bandwidth, low-latency data flow paths, supporting trillion+ parameter large model deployment, overall solution cost reduced by 50% compared to same-industry products, energy efficiency improved by , is Tsingmicro's main chip product for large-scale AI application scenarios such as AI computing centers.

Positioning: Cloud training+inference integrated chip (RPU architecture, different from GPU/ASIC paths), relying on reconfigurable architecture's flexibility, simultaneously supporting training and inference scenarios.

Core Specifications$

ItemParameter
ArchitectureSelf-developed RPU (Reconfigurable Processing Unit), reconfigurable computing architecture
ProcessNot disclosed (estimated 7nm/6nm)
FP32/FP16/INT8 ComputeNot disclosed (official sources have not disclosed specific TFLOPS/TOPS values)
C2C Computing GridUnique architecture, high-bandwidth, low-latency data paths, scalability and flexibility superior to traditional switch solutions
Large Model SupportTrillion+ parameter large model deployment
MemoryNot disclosed (estimated 32-64GB HBM2e/HBM3)
Memory BandwidthNot disclosed (estimated 1-2 TB/s)
TDP300 W (estimated)
InterconnectC2C grid interconnect (multi-card expansion)
Release2024 (mass production)
Mass ProductionSince 2024
Software StackTsingmicro software stack (supports PyTorch/TensorFlow adaptation)

⚠️ Specification Note: Detailed specifications of TX81 (TDP, memory, specific compute values) are not fully disclosed by official sources. Some values above are estimates based on public reports, subject to Tsingmicro's subsequent official data sheet.

RPU Architecture Advantages

Tsingmicro's RPU architecture is the fourth category of general-purpose computing chips beyond CPU, FPGA, and GPU**:

FeatureRPU (Reconfigurable)GPUAdvantage
Energy EfficiencySame compute power consumption 50%+ lower than GPUBaselineRPU better
FlexibilityHardware-level reconfigurable, algorithm-hardware co-optimizationFixed architectureRPU more flexible
ScalabilityC2C computing grid, no external switch bottleneckNVLink/InfiniBandArchitecture-level advantage
CostSolution cost 50% lower than same industryBaselineRPU better

Tsingmicro Product Matrix

SeriesPositioningRepresentative ProductRelease
TX5 SeriesIoT/edge visionTX5102021
TX8 SeriesCloud high computeTX812024
TX8 Series (Next Generation)Cloud high compute (upgraded)TX82 (planned)2026 (planned)

Verified Deployments

  • REX1032 Training-Inference Integrated Server: Equipped with TX81 chips, supports trillion-parameter large model deployment
  • Adapted to DeepSeek-R1 series models: Has achieved server deployments in multiple industries
  • Application Scenarios: AI computing centers, finance, energy and other industries

Shipment Status$

ProductShipment Volume
Reconfigurable chips (all categories, including IoT)Over 30 million units
Cloud AI computing cards (TX81, etc.)Over 20,000 units

Application Scenarios$

  • AI computing centers (C2C grid architecture, low latency high bandwidth)
  • Trillion-parameter large model training/inference (TX81 verified)
  • Cost-sensitive projects (solution cost reduced 50%)
  • Energy efficiency-sensitive data centers (energy efficiency improved 3×)
  • DeepSeek and other domestic large model deployments (already adapted)
  • CUDA ecosystem strong dependency (RPU is independent architecture, requires migration)
  • Public compute benchmarks (official sources have not disclosed specific TFLOPS)

Product Evolution$

ProductReleaseStatus
TX510 (IoT vision)2021On sale
TX81 (cloud high compute)2024Current main force
TX82 (cloud high compute upgraded)2026 (planned)Next generation

References$