AI Compute Card Future Roadmap (2025–2027)

Based on vendor announcements, supply chain reports, and industry analysis. Actual release dates subject to official vendor confirmation. Last updated: 2026-06-04.

2025 Q2–Q4 (Launched / In Production)

Date	Product	Vendor	Key Details
2025-04	NVIDIA B200	NVIDIA	Blackwell, 192GB HBM3e, 9 PFLOPS FP8
2025-04	NVIDIA GB200	NVIDIA	2× B200 + Grace CPU, flagship LLM inference
2025-05	AMD MI355X	AMD	CDNA 4, 288GB HBM3e, 5 PFLOPS FP8 dense
2025-06	Google TPU v6e (Trillium)	Google	918 TFLOPS BF16, 32GB HBM, GA
2025-08	Huawei Ascend 910C	Huawei	Dual-die 910B, 780 TFLOPS BF16, domestic production
2025-09	NVIDIA B300 Ultra	NVIDIA	288GB HBM3e, 14 PFLOPS FP4, 1,400W liquid-cooled
2025-12	AWS Trainium 3	AWS	3nm, 5.7 PFLOPS FP8 dense, re:Invent GA
2025-12	Google TPU v7 (Ironwood)	Google	192GB HBM, 2,307 TFLOPS BF16, inference-optimized

2026 H1 (Launched / In Production)

Date	Product	Vendor	Key Details
2026-Q1	Huawei Ascend 950PR / 950DT	Huawei	1 PFLOPS FP8, in-house HiBL/HiZQ HBM, in production
2026-Q1	Cambricon MLU690	Cambricon	2 PFLOPS FP8 dense, 192GB HBM3E, shipping
2026-Q1	AMD MI350X	AMD	CDNA 4, 192GB HBM3e, 2.5 PFLOPS FP16, available
2026-02	Moore Threads MTT S5000	Moore Threads	1,000 TFLOPS, 80GB GDDR6X, specs public
2026-06	NVIDIA Vera Rubin R200	NVIDIA	✅ Full production (announced at GTC Taipei)
2026-06	NVIDIA RTX Spark	NVIDIA	20-core Grace + Blackwell GPU, 1 PFLOPS AI PC chip

2026 H2 (Upcoming / Highly Anticipated)

Date	Product	Vendor	Expected Specs
2026-H2	NVIDIA Rubin R200 Shipping	NVIDIA	288GB HBM4, 50 PFLOPS FP4, NVLink 6
2026-H2	NVIDIA Rubin NVL72 Rack	NVIDIA	72 Rubin + 36 Vera, 1.8 EFLOPS FP4
2026-H2	AMD MI400 + Helios Rack	AMD	432GB HBM4, 40 PFLOPS FP4, 19.6 TB/s
2026-H2	Cerebras WSE-4	Cerebras	1.4 trillion transistors, 125 PFLOPS FP8
2026-Q4	Huawei Ascend 950DT Full Ramp	Huawei	950DT Decode + training mass production
2026-Fall	NVIDIA RTX Spark Retail	NVIDIA	Asus / Dell / HP / Lenovo / Microsoft launch partners

2027 (Outlook)

Date	Product	Vendor	Expected Direction
2027	NVIDIA Rubin Ultra / Feynman	NVIDIA	Next-next-gen architecture, possibly wafer-scale
2027	AMD MI500	AMD	CDNA 5, HBM4e or 3D stacking
2027	Google TPU v8 8t/8i	Google	Training/inference split architecture, optical interconnect
2027-Q4	Huawei Ascend 960	Huawei	FP8 ~2 PFLOPS, N+3 process
2027	Intel Jaguar Shores	Intel	Xe-HPC + Gaudi converged architecture

Key Technology Trends

HBM4 / In-House HBM (2026–2027)

• HBM4 (NVIDIA Rubin / AMD MI400): 1,024-bit interface, 2.4+ TB/s/stack
• Huawei in-house HiBL/HiZQ: First Chinese enterprise to achieve in-house HBM mass production (950PR/950DT)
• HBM4e: Late 2027, likely for Rubin Ultra

Personal AI Computing (2026 Emerging Trend)

• NVIDIA RTX Spark: AI PC chip, 1 PFLOPS, shipping Fall 2026
• Apple M5 Ultra: Local LLM inference, 192GB unified memory
• Qualcomm Snapdragon X Elite 2: 2027, AI PC continues to evolve
• Significance: AI compute extends from datacenters to personal devices

Wafer-Scale / Rack-Scale (2026+)

• NVIDIA Rubin NVL72: 72 GPU + 36 CPU, rack-scale AI factory
• AMD Helios: 432GB HBM4, 260 TB/s UALink interconnect
• Cerebras WSE-4: 1.4T transistor wafer-scale engine
• Huawei CloudMatrix 384: 384-chip interconnect, total BF16 compute ~300 PFLOPS

Low-Precision Computing (FP4 / INT4)

• NVIDIA Rubin R200: 50 PFLOPS FP4 (sparse), 2.8× Blackwell
• AMD MI400: 40 PFLOPS FP4 (dense), Helios rack ~2 ExaFLOPS
• Huawei HiF8: Proprietary FP8 variant, precision approaching FP16
• Trend: FP8 → FP4 → INT4, trading precision for compute, models trained at ever-lower precision

Domestic Alternatives Accelerating (2026 Three-Pole Landscape)

Vendor	Flagship	Compute	HBM	Ecosystem	Status
Huawei	Ascend 950DT	1 PFLOPS FP8	In-house HiZQ 144GB	CANN + MindSpore	In production
Cambricon	MLU690	2 PFLOPS FP8	HBM3E 192GB	NeuWare + MindSpore	Shipping
Moore Threads	MTT S5000	1,000 TFLOPS	GDDR6X 80GB	MUSA + MUSIFY	Specs public

Release Timeline (Visual)

timeline
    title AI Compute Card Release Roadmap (2025-2027)
    section 2025 H1
        NVIDIA B200          : Launched
        AMD MI355X           : Launched
        Google TPU v6e       : GA
    section 2025 H2
        NVIDIA B300 Ultra    : Launched
        AWS Trainium 3       : GA
        Google TPU Ironwood  : Launched
        Huawei Ascend 910C   : In Production
    section 2026 H1
        NVIDIA Vera Rubin    : Full Production
        NVIDIA RTX Spark     : Launched
        Huawei Ascend 950PR/DT : In Production
        Cambricon MLU690     : Shipping
    section 2026 H2
        Rubin NVL72          : Shipping
        AMD MI400 Helios     : Expected H2
        Cerebras WSE-4       : Expected
        RTX Spark Retail     : Fall
    section 2027
        NVIDIA Feynman       : Outlook
        AMD MI500            : Outlook
        Google TPU v8        : Outlook
        Huawei Ascend 960    : Roadmap

Data Sources & Updates

• Official vendor announcements (NVIDIA GTC Taipei 2026, Computex 2026, AMD Advancing AI, Huawei Connect)
• Supply chain leaks (DigiTimes, Tom's Hardware, ServeTheHome)
• Industry analyst reports (TrendForce, Jon Peddie Research)
• Last updated: 2026-06-04, based on Computex 2026 / GTC Taipei latest announcements

Found incorrect or missing information? Submit an Issue!

---

← Back to Home | Full Comparison Table →